SG-BGA-6377 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.23mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized 6061 Aluminum.
2 _{Thickness = 6.5mm.}
A
A
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 3.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Side View
(Section AA)
1
Assembled
9.30mm +
IC thickness
32.23mm
4
3
Recommended torque = 5 in lbs.
9
2
8
7
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 15.87mm long.
9
Socket lid screw: Socket head cap, alloy steel with
black oxide finish, 4-40 fine thread , 4.76mm long.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
10
6
SG-BGA-6377 Drawing
© 2013 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Customer's ⁵
BGA IC
11
Customer's Target PCB
Status: Released
Drawing: S. Huang
File: SG-BGA-6377 Dwg.mcd
Scale: -
Rev: A
Date: 03/04/2013
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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