SG-BGA-6374 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

18.1250
GHz BGA Socket - Epoxy mount, solderless
Features
• Directly mounts to target PCB (needs epoxy)
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable socket lid
A
A
Assembled
8.0mm +
IC thickness
11.0000
6
4
1
3
2
Epoxy
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
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Socket Base: Black anodized Aluminum.
2 Thickness = 5mm.
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Compression Plate: Black anodized Aluminum.
3 Thickness = 2.5mm.
____________________________________
Compression Screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
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Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
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Socket Lid Screw: Socket head cap, SS, 0-80
6 fine thread, 4.76mm long.
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SECTION A-A
5
Description: GHz BGA Socket - Epoxy mount
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6374 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 4.55
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
STATUS: Released
ENG: R. Patil
FILE: SG-BGA-6374 Dwg
SHEET: 1 OF 5
DRAWN BY: R. Patil
DATE: 02/20/2013
REV. B
SCALE: 4:1