SG-BGA-6369 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
42.2300
Features
• Directly mounts to target PCB.
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable socket lid
A
A
TOP VIEW
Recommended torque = 6 in-lbs ( 500-550 pins)
= 7 in-lbs ( 550-600 pins)
10.16
12.3
24.33
6.4
SECTION A-A
SIDE VIEW
28.23
Description: SG-BGA529 23x23mm 1.00/0.8mm pitch 27x27 array w/ heat sink screw
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6369 Specification
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 44.95
STATUS: Released
DRAWN BY: V. Panavala
FILE: SG-BGA-6369
SHEET: 1 OF 4
SCALE: 3:2
DATE: 12/11/2012
REV. A