SG-BGA-6357 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
17.625mm
A
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Side View
(Section AA)
1
Assembled
8.0mm +
IC thickness
13.125mm
Recommended torque 0.22 in lb (3.5 in oz).
4
6
3
2
Epoxy
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
Customer's
BGA IC
10.63mm
FO_SR_G-1_B2_G.5_AX8_-M₆₃M₅0₇.8M_DM_rawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Drawing: S. Huang
File: SG-BGA-6357 Dwg
Scale: -
Rev: B
Date: 12/12/12
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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