SG-BGA-6355 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Epoxy mount, solderless
26.625
Features
• Directly mounts to target PCB (needs epoxy)
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable socket lid
A
A
TOP VIEW
Target PCB
Recommended torque = 2.5 in-lbs
BGA IC
10.9312
20.3562
SECTION A-A
SIDE VIEW
Description: BGA389 Socket 0.8mm pitch 22x22mm IC
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6355 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 36.50
30.725
35.56
STATUS: Released
ENG: S. Huang
FILE: SG-BGA-6355
SHEET: 1 OF 5
DRAWN BY: S. Huang
DATE: 2/17/2012
REV. B
SCALE: 2:1