SG-BGA-6337 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
47.725mm
A
Side View
(Section AA)
1
Assembled
10.01mm +
IC thickness
47.725mm
6
Customer's
BGA IC
SG-BGA-6337 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
11
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 7.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 4.0mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Recommended torque = 32.5 in/lbs.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
9
Elastomer Guide: Cirlex or equivalent.
6 _{Thickness = 0.725mm.}
2
8
7
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
10
11 Backing Plate: Anodized Aluminum 6.35mm thick.
Customer's Target PCB
Status: Released
Drawing: M.A. Fedde
File: SG-BGA-6337 Dwg.mcd
Scale: -
Rev: A
Date: 11/23/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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