SG-BGA-6335 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
37.725mm
GHz CGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
IC guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm. (with air flow holes - x4)
2
Socket base: Black anodized Aluminum.
Thickness = 8.5mm.
1
Assembled
11.25mm +
IC thickness
37.725mm
4
3
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm. (with air flow holes - x4)
Compression screw: Clear anodized Aluminum.
Recommended torque = 15 in lbs. ^{4 Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
9
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent
6 _{Thickness = 0.725mm.}
2
7 ^{IC Guide: FR4, Ultem, or Torlon.}
8
7
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 19.05 mm long.
Side View
(Section AA)
6
5
Customer's
11
BGA IC
10
Customer's Target PCB
9 Socket lid screw: Shoulder screw, , 0-80 fine thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm}
SG-BGA-6335 Drawing
© 2014 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 9/17/14
File: SG-BGA-6335 Dwg
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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