SG-BGA-6325 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
(without fan)
A
65mm
Side View
(Section AA)
79.44mm Assembled
7
6
1
BGA IC
4
7.94mm
5
SG-BGA-6325 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
A
65mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
10
Recommended Torque 0.38in-lb
(6 in-oz) per screw
2 _{Target PCB}
3
8
9
Socket base: Black anodized Aluminum.
1 ^{Thickness = 6.5mm.}
Elastomer: 40 micron dia gold plated brass
2 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
3 ^{Elastomer Guide: Cirlex or equivalent.}
Thickness = 0.725mm.
4
Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
5 black oxide finish, 0-80 fine thread , 1/2" long.
Socket lid screw: Socket head cap, alloy steel with
6 black oxide finish, 0-80 fine thread , 3/8" long.
7
Heat Sink Lid: Aluminum
8
Insulation Plate: FR4/G10, 1.59mm thick.
Backing Plate: Black anodized aluminum
9 Thickness = 6.35mm.
10 ^{Fan: 12V}
Status: Released
Scale: 1:0.8
Rev: A
Drawing: E Smolentseva
Date: 8/24/10
File: SG-BGA-6325 Dwg
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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