SG-BGA-6324 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
42.23mm
A
Side View
(Section AA)
1
Assembled
20.375mm +
3
IC thickness
11
32.225mm
10
6
5
Customer's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
4
Recommended torque = 9 in lbs./
144 in oz.
9
2
8
7
Customer's Target PCB
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Heat sink compression screw: Black anodized
4 Aluminum. Hex socket = 5mm, fin height 10 mm,
octagonal
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Fillister head, Alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder Screw, 18-8 SS, 0-80 fine
thread.
10 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
11 IC Frame: Ultem 1000, 1.08mm thick.
SG-BGA-6324 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400 Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S.Natarajan
File: SG-BGA-6324 Dwg
Scale: -
Rev: A
Date: 6/9/2010
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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