SG-BGA-6323 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
28.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
28.225mm
10
6
Customer's
BGA IC
SG-BGA-6323 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Ø 14mm
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
4
3
Recommended torque = 1 in oz. / screw
9
2
8
7
5
11
Customer's Target PCB
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Black anodized Aluminum.
4 3-48 thread (x4)
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Cap head, Alloy steel with black
oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 Insulation Plate: FR4/G10, 1.59mm thick.
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 6/22/10
File: SG-BGA-6323 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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