SG-BGA-6311 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
26.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
26.225mm
10
6
Customer's
BGA IC
SG-BGA-6311 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 7 in lbs.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Black anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Socket head cap, alloy steel with
9 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Status: Released
Drawing: B. Schatz
File: SG-BGA-6311 Dwg.mcd
Scale: -
Rev: B
Date: 05/01/2014
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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