SG-BGA-6305 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
A
36.13mm
36.13mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Easily removable socket lid
Backing Plate
may be required.
Contact Ironwood
with application
details
Recommended torque is 12.37 in lb for 632 balls
1
3
Assembled
8.5mm +
IC thickness
4
6
2
Epoxy
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
Socket ba se : Black a nodized 606 1 A luminum.
2 _{Thickn ess = 6.5mm.}
Compression Plate: B lack ano dize d 6 061
3 _{Alu min um. Th ickness = 2 .5mm.}
Compression screw: Clear an odized 6061
4 Alu min um. Thickn ess = 5mm, Hex socket = 5mm.
Ela stomer: 4 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
Socket lid screw: Socket hea d cap , Alloy steel with
6 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
7
Bal l Gu ide: 0 .0 10" thick Kapton
Side View
(Section AA)
Cust om er's
BGA IC
SG-BGA-6305 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
5
7
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's Target PCB
Status: Released
Drawing: Vinayak R
File: S G-BGA -6305 Dwg
Scale: -
Rev: B
Date: 3/18/2010
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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