SG-BGA-6303 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Open Top socket lid
A
Top View
1
Assembled
5mm +
IC thickness
7.35mm sq.
10.85mm sq.
A
Torque: 0.38 in-lb per screw
7
2
6
5
1
Socket Lid/Compression plate: Black anodized
Aluminum. Total Height = 4.75mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 3mm.
Elastomer: 40 micron dia gold plated brass
3 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
4 ^{Elastomer Guide: Non-clad FR4.}
Thickness = 0.75mm.
5 _{Ball Guide: Kapton polyimide.}
6 ^{Socket base screw: Socket head cap, alloy steel with}
black oxide finish, 0-80 fine thread , 9.525mm long.
7
Socket lid screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
8 Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
Nylon washer: 1.73mm ID; 4.78mm OD
9 _{0.64mm thickness.}
Side View
(Section AA)
8
4
Customer's
BGA IC
9
3
Customer's Target PCB
SG-BGA-6303 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S. Faiz
File: SG-BGA-6303 Dwg.mcd
Scale: - N/A
Rev: A
Date: 3/30/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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