SG-BGA-6302 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
43.23mm
43.23mm 42.225mm
A
0.85mm
Side View
(Section AA)
1
3
Customer's BGA IC
6
11
SG-BGA-6302 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Heat sink type screw - 42.225mm
4 _{octagon shape, 10mm fins. Hex socket = 7mm Black}
anondized aluminum
Power dissipated is 4.5W
Elastomer: 40 micron dia gold plated brass
Recommended torque = 24 in lbs. ^{5 filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
4
9
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.75mm.
2
10
8
7
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 2-56 fine thread , 0-80 thread}
12.7mm long.
Socket lid screw: Shoulder 18 stainless steel 0-80
9 _thread
5
Customer's Target PCB
10 ^{IC Frame: Ultem 1000.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 8.35mm.}
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 3/3/10
File: SG-BGA-6302 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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