SG-BGA-6301 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
40.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
A
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 6.5mm.}
40.225mm
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 24 in lbs.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
1
4
Elastomer: 40 micron dia gold plated brass
9
3
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
2
7 ^{Ball Guide: Kapton polyimide.}
8
7
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
Customer's
5
6
11
BGA IC
Customer's Target PCB
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
SG-BGA-6301 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr Ste 400 Burnsville, Mn 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: M.A. Fedde
File: SG-BGA-6301 Dwg.mcd
Scale: -
Rev: A
Date: 2/23/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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