SG-BGA-6299 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
12
32.225mm
10
6
Customer's
BGA IC
SG-BGA-6299 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Ø 15mm
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
4
3
Recommended torque = 6 in oz. / screw
9
2
8
7
5
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Black anodized Aluminum.
4 _{3-48 thread (x4)}
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Cap head, Alloy steel with black
8 _{oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
Backing Plate: Anodized Aluminum 6.35mm thick.
11
12 ^{IC Frame: Ultem}
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 2/16/10
File: SG-BGA-6299 Dwg
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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