SG-BGA-6296 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
50.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Assembled
10.11mm +
IC thickness
Side View
(Section AA)
1
6
50.225mm
4
3
Customer's
5
11
BGA IC
A
Recommended torque = 40 in lbs./
640 in oz.
9
2
8
7
10
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 6.5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Ultem.
Thickness = 0.725mm.
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 15.815mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
SG-BGA-6296 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Vinayak R
File: SG-BGA-6296 Dwg
Scale: -
Rev: A
Date: 1/14/09
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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