SG-BGA-6286 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
20.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
20.225mm
6
10
Customer's
BGA IC
SG-BGA-6286 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 1 in lbs.
9
2
12
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy stell with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 _{0.64mm thickness.}
12 ^{IC Frame: Ultem}
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 3/3/10
File: SG-BGA-6286 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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