SG-BGA-6284 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
A
26.225mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
A
Compression plate distributes forces evenly
Easily removable socket lid
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized 6061 Aluminum.
2 _{Thickness = 6.5mm.}
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
26.225mm
recommended torque 4.17 in lb.
4
1
6
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Socket lid screw: Socket head cap, Alloy steel with
6 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Assembled
8.5mm +
IC thickness
Side View
(Section AA)
Customer's
BGA IC
SG-BGA-6284 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
7 ^{Ball Guide: 0.010" thick Kapton or Ultem}
2
3
Epoxy
7
5
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's Target PCB
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 3/18/10
File: SG-BGA-6284 Drawing.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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