SG-BGA-6275 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
GHz BGA Socket - Epoxy mount, solderless
A
40.225mm
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
A
Compression plate distributes forces evenly
Easily removable socket lid
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
Socket ba se : Black a nodized 606 1 A luminum.
2 _{Thickn ess = 6.5mm.}
Compression Plate: B lack ano dize d 6 061 Alu min um.
3 _{Thickn ess = 2.5mm.}
40.225mm
recommended torque 14.64 in lb
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Ela stomer: 4 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
Socket lid screw: Socket hea d cap , Alloy steel with
6 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
1
4
7 ^{Bal l Gu ide: 0 .0 10" thick Kapton or Ulte m}
Assembled
8.5mm +
IC thickness
Side View
(Section AA)
6
8 ^{IC Frame: Ultem}
3
2
8
7
Epoxy
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's BGA IC
Customer's Target PCB
SG-BGA-6275 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
File: S G-BGA -6275 Dwg.mcd
Date: 8/1/08
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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