SG-BGA-6267 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
30.50mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Side View
40.10mm
1
Assembled
8.25mm +
IC thickness
10
6
SG-BGA-6267 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 4 - 6 in lbs.
4 Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
4
rubber (63.5 degree angle).
Thickness = 0.75mm.
9
8
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 Ball Guide: Kapton polyimide.
2
7
Socket base screw: Philips round head, alloy steel
8 _{with black oxide finish, 2-56 fine thread , 12.7mm long.}
Socket lid screw: Socket head cap, alloy steel with
9 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
11
Customer's Target PCB
10 ^{Insulation Plate: Ultem, 3.5mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Status: Released
Drawing: V. Panavala
File: SG-BGA-6267 Dwg.mcd
Scale: 2:1
Rev: A
Date: 10/13/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4