SG-BGA-6261 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
36.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
9.675mm +
IC thickness
36.225mm
4
3
A
Socket Li d: Bla ck a nodized Alu mi num.
1 _{Thickn ess = 2.5mm.}
2
Socket ba se : Black a nodized Alumin um.
Thickn ess = 5mm.
Compression Plate: B lack ano dize d A luminum.
3 _{Thickn ess = 2.5mm.}
Compression screw: Clear an odized Aluminu m.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Recommended torque = 3.3 in lbs.
Ela stomer: 4 0 micron dia go ld plated brass
filaments ar ranged symmetrically in a silicone
5 rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
9
Ela stomer Guid e: Cirlex o r e quiva lent
6 _{Thickn ess = 0.725mm.}
2
8
7
7 ^{Bal l Gu ide: K apton polyimide.}
Socket ba se screw: Socket hea d cap , Alloy steel with
8 _{bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .}
Socket lid screw: Socket hea d cap , Alloy steel with
9 _{oxide finish, 0-8 0 fine threa d , 4.76mm lo ng.}
10 ^{Insulation Plate: FR4/G10, 1.5 9mm thick.}
6
11
SG-BGA-6261 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Cust om er's
BGA IC
10
11
5
Customer's Target PCB
12
12
Status: Released
Drawing: Umer Qureshi
File: SG -BG A-62 61 Dwg
Scale: -
Rev: A
Date: 03/14/08
Modified:
Backing Plate: Bla ck anodized Alu minum, Thickn ess
= 6.35mm.
IC Gui de : FR4
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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