SG-BGA-6259 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
60 mm
A
7
Max Height
19.63mm ⁶
BGA IC
Side View
(Section AA)
4
SG-BGA-6259 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
1
Torque =1 in-lbs/screw
2
3
5
Target PCB
Heatsi nk Lid : Black an odized Aluminu m.
1 _{Thickn ess = 16mm.}
Socket ba se : Black a nodized Alumin um.
2 Thickn ess = 8mm.
Ela stomer: 4 0 micron dia go ld plated brass
3 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
4
Ela stomer Guid e: Cirlex o r e quiva lent.
Thickn ess = 0.725mm.
Bal l Gu ide: K apton polyimide.
5 _{Thickn ess = 0.25mm.}
Socket ba se screw: Socket hea d cap , Alloy steel with
6 _{bla ck o xid e finish, 0-80 fine th read , 15 .87 5mm lon g.}
Socket lid screw: Socket hea d cap , Alloy steel with
7 _{bla ck o xid e finish, 0-80 fine th read , 6.35mm long.}
Backing Plate: B lack ano dize d Aluminum.
8 _{Thickn ess = 6.35mm.}
Insulation Plate: FR4/G10, Th ickness = 1 .59 mm.
9
Compression screw: S ocket head cap, A lloy ste el with
10 ^{bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .}
Status: Released
Drawing: A. Evans
File: S G-BGA -6259 .dwg
9
8
Scale: 1:0.7
Rev: A
Date: 06/10/08
Modified:
PAGE 1 of 5
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.