SG-BGA-6258 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
42.23mm
A
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
6
10
32.225mm
5
Customer's
BGA IC
Recommended torque = 9 in lbs./
144 in oz.
4
9
3
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 Thickness = 2.5mm.
Heat sink compression screw: Black anodized
4 Aluminum. Hex socket = 5mm, fin height 10 mm,
octagonal
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Fillister head, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 Insulation Plate: FR4/G10, 1.59mm thick.
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
SG-BGA-6258 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6258 Dwg
Scale: -
Rev: D
Date: 01/14/08
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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