SG-BGA-6255 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
18.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
M
Minimum real estate required
R
Compression plate distributes forces evenly
1
Ball guide prevents over compression of elastomer
R
Easily removable swivel socket lid
1
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
18.225mm
1
4
3
6
10
Customer's
BGA IC
5
12
A
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
3
4
Recommended torque = 1 in lbs.
5
9
6
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
2
8
7
11
Customer's Target PCB
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy steel with
8 black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 _{0.64mm thickness.}
12 IC Guide: Torlon
SG-BGA-6255 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6255 Dwg.mcd
Scale: -
Rev: C
Date: 02/04/08
Modified: 07/08/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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