SG-BGA-6249 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225 mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
7
18.75mm
+ IC thickness
6
10
BGA IC
Side View
(Section AA)
4
SG-BGA-6249 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
A
1
2
3
Status: Released
Drawing: J. Glab
File: SG-BGA-6249 Dwg
Torque = 0.5 to 1 in-lbs
1
Heatsink Lid: Black anodized Aluminum.
Thickness = 18mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Elastomer: 40 micron dia gold plated brass
3 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
4 _{Thickness = 0.725mm.}
Ball Guide: Kapton polyimide.
5 _{Thickness = 0.25mm.}
6
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
7 _thread.
8
Backing Plate: Black anodized 6061 Aluminum.
Thickness = 6.35mm.
9 _{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
5
Target PCB
9
8
Scale: 2:1
Rev: B
Date: 11/09/07
Modified: 5/19/09
PAGE 1 of 5
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.