SG-BGA-6248 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

19.13mm
17.13mm
A
Top View
4
Assembled
8.0mm +
IC thickness
3
1mm
Side View
(Section AA)
15.925mm
SG-BGA-6248 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Recommended torque is 1-1.5 in lb.
6
1
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
2
Customer's BGA IC
5
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6248 ASpec
Scale: N/A
Rev: C
Date: 11/01/07
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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