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SG-BGA-6247 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
Top View
32.225mm
A
1
Assembled
8.25mm +
IC thickness
11
32.225mm
4
3
Side View
(Section AA)
6
5
Customer's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 59 in lbs./
81044ininozo.z.
9
2
8
7
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
3 Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 Thickness = 0.725mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Fillister head, Alloy steel with
8 black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 thread.
10 Backing Plate: Anodized Aluminum 6.35mm thick.
11 IC Frame: Ultem 1000.
10
Customer's Target PCB
SG-BGA-6247 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6247 Dwg
Scale: -
Rev: B
Date: 10/31/07
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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