SG-BGA-6246 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
42.23mm
A
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
32.225mm
Assembled
8.25mm +
IC thickness
10
6
Customer's
BGA IC
SG-BGA-6246 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Recommended torque = 9 in lbs./
144 in oz.
4
9
3
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Heat sink compression screw: Black anodized
4 Aluminum. Hex socket = 5mm, fin height 10 mm,
octagonal
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
2
8
7
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Fillister head, Alloy steel with
8 black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11
5
Backing Plate: Anodized Aluminum 6.35mm thick.
11
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6246 Dwg
Scale: -
Rev: C
Date: 11/01/07
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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