SG-BGA-6243 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

GHz BGA Socket - Direct mount, solderless
Features
M
15.225mm
Directly mounts to target PCB (needs tooling holes) with hardware.
R
High speed, reliable Elastomer connection
1.
Minimum real estate required
2.
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
R
1.
Easily removable swivel socket lid
A
Top View
15.225mm
1
Assembled
8.25mm +
IC thickness
12
Side View
(Section AA)
6
10
Customer's
BGA IC
4
3
5
A
Recommended torque = 1in lbs.
9
2
8
7
11
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Ultem.
Thickness = 0.725mm.
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 _{0.64mm thickness.}
12 ^{IC Guide: Torlon.}
SG-BGA-6243 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6243 Dwg.mcd
Scale: -
Rev: C
Date: 10/05/07
Modified: 11/14/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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