English
Language : 

SG-BGA-6239 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
Top View
26.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
12.6mm Sqr.
26.225mm
8
Assembled 9
9mm
Side View
(Section AA)
10
6
Customer's
BGA IC
SG-BGA-6239 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
A
R 2mm (x4)
Recommended torque =
1 in. lb (x4 screws)
2
4
1
3
5
Socket base: Black anodized Aluminum.
1 Thickness = 5mm.
Socket lid screw: Socket head cap, alloy steel with
2 black oxide finish, 0-80 fine thread , 6.35mm long.
Socket base screw: Socket head cap, alloy steel with
3 black oxide finish, 0-80 fine thread , 12.7mm long.
4 IC Frame: Ultem 1000
5 Ball Guide: Kapton polyimide.
Elastomer Guide: Non-clad FR4.
6 Thickness = 0.725mm.
Elastomer: 40 micron dia gold plated brass
7
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Socket Lid/ Compression Plate : Black anodized
8 Aluminum.
Thickness = 8mm
9 IC Guide: Ultem 1000
10 Insulation Plate: FR4/G10, 1.59mm thick.
11 Backing Plate: Anodized Aluminum 6.35mm thick.
11
7
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6239 Dwg
Scale: -
Rev: A
Date: 9/13/07
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4