SG-BGA-6238 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
30mm Sqr.
A
Assembled ¹²
24.7mm +
IC thickness
9
Side View
(Section AA)
10
6
Customer's
BGA IC
SG-BGA-6238 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A ^{Recommended Torque =}
1 in. lbs (x4 screw)
8
2
4
1
3
5
Socket base: Black anodized Aluminum.
1 Thickness = 5mm.
Socket lid screw: Socket head cap, alloy steel with
2 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Socket base screw: Socket head cap, alloy steel with
3 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
4 ^{IC Frame: Ultem 1000}
5 ^{Ball Guide: Kapton polyimide.}
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
Elastomer: 40 micron dia gold plated brass
7
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Heat sink/ compression Plate: Black anodized
8 _Aluminum.
9 ^{IC Guide: Ultem 1000}
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
Thermal Pad: Bergquist Gap Pad 1500
12 Thickness = 1mm.
11
7
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6238 Dwg
Scale: -
Rev: A
Date: 9/13/07
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 5