SG-BGA-6230 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
40.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
1
6
40.225mm
4
3
Recommended torque = 24 in lbs.
9
2
8
7
Customer's
5
11
BGA IC
10
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 6.5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid screw: Shoulder Screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
SG-BGA-6230 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6230 Dwg.mcd
Scale: -
Rev: B
Date: 07/05/07
Modified: 1/27/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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