SG-BGA-6226 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

32.51mm
A
32.51mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
7
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
Top View
16.61mm±0.25mm
4
3
8
Side View
Section A-A
Recommended torque is 3 in lb for the swivel lid
and hand tighten for the heat sink lid.
1
Customer's
BGA IC
2
5
9
6
Customer's Target PCB
Heatsink Lid: Black anodized Aluminum.
1 _{Thickness = 16mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Elastomer: 40 micron dia gold plated brass
3 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
4
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.75mm.
Ball Guide: Kapton polyimide.
5 _{Thickness = 0.25mm.}
Socket base screw: Socket head cap, Alloy steel with
6 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
7 _thread.
Backing Plate: Black anodized Aluminum.
8 Thickness = 6.35mm.
9 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
SG-BGA-6226 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6226 Dwg.mcd
Scale: -
Rev: B
Date: 05/24/07
Modified: 7/20/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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