SG-BGA-6219 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
24.23mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
12
6
24.23mm
10
11
Customer's
BGA IC
SG-BGA-6219 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 3 in lb.
9
2
8
7
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a
silicone rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.745mm.
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy
8 _{steel with black oxide finish, 0-80 fine thread ,}
15.875mm long.
Socket lid screw: Shoulder screw, 18-8 SS,
9 _{0-80 fine thread.}
Insulation plate: FR4.
10 _{Thickness: 1.59mm}
11 ^{Backing plate: Black anodized Aluminum.}
Thickness = 6.3 mm.
12 ^{IC Frame: Ultem.}
Status: Released
Drawing: J. Glab
File: SG-BGA-6219 Dwg
Scale: -
Rev: B
Date: 4/5/07
Modified: 7/20/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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