SG-BGA-6216 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
17.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
9mm Square
17.125mm
Assembled
thickness 8mm
+IC thickness
Cust om er's
BGA IC
14.63mm
SG-BGA-6216 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Socket Li d/ Compression Plate: B lack ano dize d
A
1
Alu min um. Thickn ess = 2.5mm.
Socket ba se : Black a nodized Alumin um.
2
Thickn ess = 5mm.
Socket lid screw: Socket hea d cap , Alloy steel with
3
bla ck o xid e finish, 0-80 fine th read , 4.76mm long.
Ela stomer: 2 0 micron dia go ld plated brass filamen ts
4
arra nged symmetrically in a silico ne rubbe r (6 3.5
deg ree angle ).
Thickn ess = 0.5mm.
Recommended Toque
1
8 In.Oz /Srew
3
2
Epoxy
Note: Alignment guide for positioning socket
4
base to target PCB will be supplied.
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: S G-BGA -6216 Dwg
Scale:
Rev: B
Date: 1/19/07
Modified: 06/03/08
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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