SG-BGA-6209 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
20.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
20.125mm
1
Assembled
8.0mm +
IC thickness
2.5mm
Side View
(Section AA)
Customer's
BGA IC
17.125mm
SG-BGA-6209 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
A
Recommended torque is 2 in lb.
4
6
3
2
Epoxy
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: Conectl contactor
5 Thickness = 0.75mm.
Socket lid screw: Socket head cap, Alloy steel with
6 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-BGA-6209 Dwg
Scale: -
Rev: D
Date: 1/26/07
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 OF 4
Recommended PCB Layout
Top View
13.6mm