SG-BGA-6206 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
15.125 mm
A
Side View
(Section AA)
1
Assembled
8.0mm +
IC thickness
17.625 mm
4
3
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Recommended torque 1.5 in lb.
6
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 ^{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.75mm.
Socket lid screw: Socket head cap, Alloy steel with
6 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
2
Epoxy
Customer's
BGA IC
15.24mm
SG-BGA-6206 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr Ste 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Scale: -
Rev: B
Drawing: J. Glab
Date: 11/30/06
File: SG-BGA-6206 Dwg.mcd
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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