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SG-BGA-6205 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
Top View
45.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
1
Assembled
10.11mm +
IC thickness
Side View
(Section AA)
6
A
45.225mm
4
3
Recommended torque = 23 in lbs./
368 in oz.
9
2
8
7
5
11 Customer's
BGA IC
10
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 Thickness = 7.5mm.
Compression Plate: Black anodized Aluminum.
3 Thickness = 4.0mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
6 Thickness = 0.725mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 black oxide finishl, 0-80 fine thread , 12.7mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 thread.
10 Insulation Plate: FR4/G10, Thickness = 1.59mm.
Backing Plate: Black anodized Aluminum.
11 Thickness = 6.35mm.
SG-BGA-6205 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-6205 Dwg
Scale: -
Rev: B
Date: 10/30/06
Modified: 7/21/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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