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SG-BGA-6191 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
Top View
18.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
1
Assembled
8.25mm +
IC thickness
18.225mm
Side View
(Section AA)
6
10
Customer's
BGA IC
SG-BGA-6191 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400 Burnsville, MN 55337
Tele: (952-229-8211) 452-8100
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 1 in lbs.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized 6061 Aluminum.
2 Thickness = 5mm.
Compression Plate: Black anodized 6061 Aluminum.
3 Thickness = 2.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 Thickness = 0.75mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, Alloy steel with
8 black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Socket head cap, Alloy steel with
9 black oxide finish, 0-80 fine thread , 4.76mm long.
10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
11
Nylon washer: 1.73mm ID; 4.78mm OD
0.64mm thickness.
Status: Released
Drawing: H. Hansen
File: SG-BGA-6191 Dwg
Scale: -
Rev: A
Date: 10/18/06
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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