SG-BGA-6184 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

19.13mm
15.13mm
A
Top View
4
Assembled
8.0mm +
IC thickness
3
Side View
(Section AA)
15.25mm
SG-BGA-6184 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Recommended torque is 1-1.5 in lb.
6
1
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
Socket ba se : Black a nodized 606 1 A luminum.
2 _{Thickn ess = 5mm.}
3
Compression Plate: B lack ano dize d 6 061 Alu min um.
Thickn ess = 2.5mm.
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Ela stomer: 2 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
6
Socket lid screw: Socket hea d cap , Alloy steel with
bla ck o xid e finish, 0-80 fine th read , 4.76mm long.
2
Customer's BGA IC
5
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's target PCB
Status: Released
Scale: -
Rev: B
Drawing: E Smolentseva
File: S G-BGA -6184 Dwg.mcd
Date: 9/26/06
Modified: 06/03/08
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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