SG-BGA-6182 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

15.225mm
A
Top View
Assembled
8.25mm +
IC thickness
Side View
(Section AA)
15.225mm
1
12
6
10
Customer's
BGA IC
4
3
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 1- 2 in lbs.
9
2
8
7
11
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Socket base nut: 18-8 Stainless steel, 0-80 fine thread.}
Nylon washer: 1.73mm ID; 4.78mm OD
11 _{0.64mm thickness.}
12 ^{IC Guide: non clad FR4.}
SG-BGA-6182 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Nidhi Sen
File: SG-BGA-6182 Dwg.mcd
Scale: -
Rev: B
Date: 06/26/06
Modified: 6/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 3