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SG-BGA-6168 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer
15.225mm
A
Top View
Assembled
8.25mm +
IC thickness
12
Side View
(Section AA)
1
6
10
15.225mm
4
3
5
Customer's
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 0.2 in lb.
9
2
8
7
11
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Cirlex
Thickness = 0.725mm.
7 Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
11
Nylon washer: 1.73mm ID; 4.78mm OD
0.64mm thickness.
12 IC Guide: FR4 or equivalent.
SG-BGA-6168 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Status: Released
Drawing: Nidhi Sen
File: SG-BGA-6168 Dwg
Scale: -
Rev: B
Date: 06/26/06
Modified: 6/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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