SG-BGA-6159 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
36.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
12
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
36.225mm
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Recommended torque = 18 in lbs.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
1
4
rubber (63.5 degree angle).
Thickness = 0.725mm.
9
3
Elastomer Guide: Cirlex or equivalent.
6 _{Thickness = 0.75mm.}
2
8
7
6
Customer's
5
BGA IC
11
10
Customer's Target PCB
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
12 IC Frame: Black FR4
SG-BGA-6159 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6159 Dwg
Scale: -
Rev: C
Date: 8/23/05
Modified: 7/20/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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