SG-BGA-6157 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

19.13mm
16.13mm
A
Top View
4
Assembled
8.0mm +
IC thickness
3
Side View
(Section AA)
15.25mm
SG-BGA-6157 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Recommended torque is 1-1.5 in lb.
6
1
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
2
Customer's BGA IC
5
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's target PCB
Status: Released
Drawing: H. Hansen
File: SG-BGA-6157 Dwg
Scale: -
Rev: C
Date: 7/21/05
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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