SG-BGA-6150 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
32.225mm
A
Side View
(Section AA)
Assembled
8.25mm +
IC thickness
10
GHz BGA Socket - Direct mount, solderless
Ø 15mm
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
32.225mm
Recommended torque = 1 in lbs. / screw
Compression screw: Black anodized Aluminum.
4 3-48 thread (x4)
Elastomer: 40 micron dia gold plated brass
1
4
5 filaments arranged symmetrically in a silicone
9
3
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
2
8
7
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Fillister head, Alloy steel with
black oxide finish, 0-80 fine thread , 0.625" long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
6
5
Customer's
BGA IC
11
Customer's Target PCB
10 Insulation Plate: FR4/G10, 1.59mm thick.
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
SG-BGA-6150 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
File: SG-BGA-6150 Dwg
Scale: -
Rev: B
Date: 3/31/05
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4