SG-BGA-6145 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
(without fan)
A
Side View
(Section AA)
52mm Assembled
5.94mm
5
SG-BGA-6145 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
A
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Socket ba se : Black a nodized 606 1 A luminum.
1 ^{Thickn ess = 6.5mm.}
Ela stomer: 4 0 micron dia go ld plated brass
2 _{filaments ar ranged symmetrically in a silicone}
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
3
Ela stomer Guid e: Cirlex o r e quiva lent.
Thickn ess = 0.75mm.
4
Bal l Gu ide: K apton polyimide.
10
Socket ba se screw: Socket hea d cap , allo y steel with
5 bla ck o xid e finish, 0- 80 fin e thre ad , 1/2" long .
Recommended Torque 0.38in-lb
(6 in-oz) per screw
Socket lid screw: Socket hea d cap , allo y steel with
6 bla ck o xid e finish, 0- 80 fin e thre ad , 3/8" long .
7
Heat S ink Lid : Alumin um
11
6
2
1
3
8
4
Customer's Target PCB
8
Insulation Plate: FR4/G10, 1.5 9mm thick.
Backing Plate: S ta inless Steel
9 Thickn ess = 4.35mm.
10 ^{Fan: 1 2V, 0 .29 m3/min}
11 ^{Ga p P ad}
9
Status: Released
Drawing: H. Hansen
File: S G-BGA -6145 Dwg
Scale: -
Rev: B
Date: 1/3/05
Modified: 04/13/06, RP
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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