SG-BGA-6144 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
24.225mm
A
Side View
1
(Section AA)
Assembled
9.75mm +
IC thickness
24.225mm
10
6
Cust om er's
11
BGA IC
SG-BGA-6144 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
4
3
A
Recommended torque = 3 in lbs.
9
2
8
7
Socket Li d: Bla ck a nodized Aluminu m.
1 Thickn ess = 2.5mm.
Socket ba se : Black a nodized Aluminum.
2 _{Thickn ess = 6.5mm.}
Compression Plate: B lack ano dize d Alu min um.
3 _{Thickn ess = 2.5mm.}
Compression screw: Clear an odized Aluminu m.
4 _{Thickn ess = 5mm, Hex socke t = 5mm.}
Ela stomer: 4 0 micron dia go ld plated brass
5 ^{filaments ar ranged symmetrically in a silicone}
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
Ela stomer Guid e: Non-clad FR4 .
6 _{Thickn ess = 0.725mm.}
7 ^{Bal l Gu ide: K apton polyimide.}
8
Socket ba se screw: Socket hea d cap , alloy steel with
bla ck o xid e finish, 0-80 fine th read , 12 .7mm long.
Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine
9
thread .
10 ^{Insulation Plate: FR4 /G1 0, 1.59mm th ick.}
11 ^{Backing Plate: A nodized Alu min um 6 .35 mm thick.}
5
Customer's Target PCB
Status: Released
Drawing: H. Hansen
File: SG-BGA-6144 Dwg
Scale: -
Rev: C
Date: 1/25/05
Modified: 7/17/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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