SG-BGA-6141 Datasheet, PDF (1/3 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
36.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
36.225mm
4
3
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
Socket Lid: Black anodized 6061 Aluminum.
A
1 Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 6.5mm.
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
Recommended torque = 18 in lbs.
9
2
8
7
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
Elastomer Guide: Cirlex or equivalent.
6 _{Thickness = 0.75mm.}
7 ^{Ball Guide: Kapton polyimide.}
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
6
Customer's
5
BGA IC
Customer's Target PCB
SG-BGA-6141 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: B. Roux
File: SG-BGA-6141 Dwg.mcd
Scale: -
Rev: A
Date: 12/16/04
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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