SG-BGA-6137 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
45mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Heat sink lid for power dissipation
A
Side View
(Section AA)
20 watt heatsink
7
Max Height
23mm
6
BGA IC
4
SG-BGA-6137 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
A
1
2
10
3
5
Target PCB
9
8
Heatsi nk Lid : Black an odized 606 1 A luminum.
1 ^{Thickn ess = 16mm.}
Socket ba se : Black a nodized 606 1 A luminum.
2 _{Thickn ess = 5mm.}
Ela stomer: 4 0 micron dia go ld plated brass
3 ^{filaments ar ranged symmetrically in a silicone}
rub ber (63.5 degre e a ngle).
Thickn ess = 0.75mm.
Ela stomer Guid e: Cirlex o r e quiva lent.
4 _{Thickn ess = 0.75mm.}
Bal l Gu ide: K apton polyimide.
5 _{Thickn ess = 0.25mm.}
6
Socket ba se screw: Socket hea d cap , Alloy steel with
bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .
Socket lid screw: Socket hea d cap , Alloy steel with
7 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
Backing Plate: B lack ano dize d 6061 Alu min um.
8 _{Thickn ess = 6.35mm.}
9 Insulation Plate: FR4/G10, Th ickness = 1 .59 mm.
10 IC Frame: FR4/G 10
Status: Released
Drawing: H. Hansen
File: S G-BGA -6137 Dwg
Scale: 1:0.7
Rev: A
Date: 12/2/04
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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